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Smart Electronics Conventional FR4 Four-layer Gold Immersion Impedance Multilayer PCB

Products > PCB > Smart Electronics Conventional FR4 Four-layer Gold Immersion Impedance Multilayer PCB
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Smart Electronics Conventional FR4 Four-layer Gold Immersion Impedance Multilayer PCB

Conventional FR4 Four-layer Gold Immersion Impedance Multilayer PCB
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Smart Electronics PCB Board Printed Circuit Board PCB Fabrication PCB Circuit Board Factory

PCB Board Printed Circuit Board PCB Fabrication PCB Circuit Board Factory Layer:6 Material: TG170 FR-4 Thickness:1.8mm+/-10% Solder Mask: Purple Surface Finished: HASL Copper Thickness:1 OZ Drill hole(Min.):0.25mm Min.line space: 0.127mm Min.line width: 0.127mm

Smart Electronics China Shenzhen PCB, PCBA cloning , PCB manufacture and assembly

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