Chip Model | TEC1-12708 SR |
Overall Dimension | 40*40*3.7mm±0.15 |
Maximum temperature difference | 65°C |
Maximum Voltage | 15.5V |
Storage conditions | -40~-60 ° C |
Assembly pressure | 85N/cm2 |
Maximum current | max=8A (when operating at maximum voltage) |
Operating environment | temperature range -55°C ~ 83°C (high ambient temperature will directly affect the cooling efficiency) |
Packaging process | standard 704 silicone rubber sealing around |
Packaging standards | bubble box packaging, storage conditions, ambient temperature -10 ° C ~ 40 ° C |
Device characteristics | red line positive, black line negative (with the word surface for the cooling surface, without the word surface for the cooling surface) |
Wire specifications | Lead length 300mm RV standard wire single end 5mm tin plated |