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High power refrigeration device TEC1-19906 40 * 40mm 24V6A brand new semiconductor refrigeration chip

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High power refrigeration device TEC1-19906 40 * 40mm 24V6A brand new semiconductor refrigeration chip

Maximum cooling capacity: 68W

Maximum current: 6A

Working environment: Temperature range -55 ° C~83 ° C (excessive ambient temperature will directly affect refrigeration efficiency)

Packaging process: surrounded by 704 silicone rubber seal or epoxy resin sea

Packaging standard: bubble box packaging, storage conditions, environmental temperature -10 ° C~40 ° C,

Wire specification: 200-300mm

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High power refrigeration device TEC1-19906 40 * 40mm 24V6A brand new semiconductor refrigeration chip

Chip model: TEC1-19906

External dimensions: 40 * 40 * 3.6mm ± 0.1

Maximum temperature difference: 65 ° C

Recommended voltage: 24V

Assembly pressure: 85N/cm2

Maximum cooling capacity: 68W

Maximum current: 6A

Working environment: Temperature range -55 ° C~83 ° C

(excessive ambient temperature will directly affect refrigeration efficiency)

Packaging process: surrounded by 704 silicone rubber seal or epoxy resin seal

Packaging standard: bubble box packaging, storage conditions, environmental temperature -10 ° C~40 ° C,

Wire specification: 200-300mm


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