Chip Model | TEC1-12702 SR |
Overall Dimension | 30*30*3.8mm |
Maximum temperature difference | 65°C |
Maximum Voltage | 15.8V |
Storage conditions | 40~60 ° C |
Assembly pressure | 85N/cm2 |
Internal resistance | 5.8-6.2Ω(ambient temperature 23±1°C,1 KHZ Ac test) |
Maximum current | max=2A |
Operating environment | temperature range -55°C ~ 83°C (high ambient temperature will directly affect the cooling efficiency) |
Packaging process | standard 704 silicone rubber sealing around |
Packaging standards | bubble box packaging, storage conditions, ambient temperature -10 ° C ~ 40 ° C |
Device characteristics | red line positive, black line negative (with the word surface for the cooling surface, without the word surface for the cooling surface) |
Wire specifications | lead length 150 ± 8mm RV standard wire single tinned 5MM |