Product Parameters
Name: Ultra thin cob aluminum substrate / cob flexible aluminum substrate / cob bendable aluminum substrateType: Rigid-flex board
Number of layers: 2
Base material: copper / adhesive EDInsulation material: organic resin
Insulation thickness: thin plate
Flame retardant characteristics: V0 board
Processing technology: calendered foil
Reinforcing material: glass fiber cloth base
Insulating resin: polyimide resin (PI)
Product thickness: soft board 0.2mm (tolerance ±0.03mm)
Single piece size: can be customized according to the drawings provided by the customer
Copper foil thickness: 35μm (1OZ)
Solder mask: black/white
Coating and thickness: OSP (12UM-36UM)
Fire rating: 94-V0
Temperature resistance test: thermal shock 288°C 10SEC
Dielectric constant: PI3.5; AD3.9;
Processing cycle: 4-7 days for samples; 7-12 days for mass production;
Storage environment: dark and vacuum storage, temperature <25℃, humidity <70%
Processing customization: Yes