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TEC1-12730 62 * 62mm high-power semiconductor cooling chip large peltier module tec1 12730
TEC1-12730 62 * 62mm high-power semiconductor cooling chip large peltier module tec1 12730
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Chip model: TEC1-12730SR
External dimensions: 62 *62 * 4.2mm ± 0.1
Maximum temperature difference: 65 ° C
Maximum voltage: 15.8V
Recommended voltage: 12V
Assembly pressure: 85N/cm2
Maximum cooling capacity: 260W
Maximum current: 30A
Weight:68g
Wire specification: lead length 145mm
Working environment: Temperature range -55 ° C~83 ° C (excessive ambient temperature will directly affect refrigeration efficiency)
Packaging process: surrounded by 704 silicone rubber seal or epoxy resin seal
Packaging standard: bubble box packaging, storage conditions, environmental temperature -10 ° C~40 ° C,
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