Name:Sinking tin four layers of soft and hard bonding plate
Type:Rigid-Flex
Layer: Four layers
Substrate: Adhesive AR
Insulation material: organic resin
Insulation layer thickness: thin board
Flame retardant properties: V0 board
Processing Technology: Calendered Foil
Reinforcement Material: Glass Fiber Cloth Base
Insulating Resin: Polyimide Resin (PI)
Product Thickness: Soft 0.15mm; Hard 0.5mm; (Tolerance ±0.03mm)
Single piece size: customized according to customer's drawing
Thickness of copper foil: 18μm(0.5OZ)
Soldermask/Oil: Yellow film/Black film/White film/Green oil/Red oil
Plating and thickness:OSP(12UM-36UM)
Fire Rating:94-V0
Temperature Resistance Test: Thermal Shock 288℃ 10SEC
Dielectric constant:PI3.5;AD3.9.
Storage environment: Vacuum storage, lightproof, temperature <25℃, humidity <70%.
Processing customization: Yes