Outer copper thickness:1/2oz,1oz
Reinforcement: steel reinforcement, aluminum reinforcement, PI reinforcement,
FR4 reinforcement, PET reinforcement
Surface Treatment: Immersion Gold, Lead Free Tin Spray, OSP
Plate Option: Flame retardant
Backing: High temperature resistant
Copper Foil Type: Non-adhesive Calendered Copper, Non-adhesive Electrolytic Copper
Electromagnetic film: single-sided, double-sided
Forming method: film molding, laser molding, mold molding
Thickness of gold/nickel plating:2U,1U
Substrate: Polyimide (PI)
Gold finger insertion/removal: Yes
Insulation Thickness: Conventional
Test Method: AOI full test + flying probe, four-wire low resistance test, 100% flying probe test,
AOI full test + flying probe full test, flying probe full test, engineering testing jig
Character color:black,white
Number of layers:12
Minimum line width/spacing: 0.125mm, 0.1mm
Minimum Hole Diameter:0.1mm
Board thickness:0.12mm
Insulation Resin
Polyester resin (PET)